MSI FX5900 SP-VTD256

GeforceFX 5900 Chipset Features

NVIDIA CINEFX 2.0 Engine
• Advanced pixel shaders deliver 2x the floating-point shader pixel performance of previous generations.
• Support for Microsoft® DirectX® 9.0 (DX9) pixel shader 2.0+.
• Support for DX9 vertex shader 2.0+.
• Long pixel programs up to 1,024 instructions.
• Long vertex programs up to 256 static instructions with up to 65,536 instructions executed.
• Dynamic, conditional execution and flow control.
• Architected for Cg and Microsoft HLSL for maximum compatibility for nextgeneration content.
• 128-bit, studio-quality, floating-point precision computation through the entire rendering
pipeline.
• Native hardware support for 32 bpp, 64bpp and 128 bpp rendering modes.
• Up to 12 pixel shader operations/clock.
• Up to 16 textures per rendering pass.
• Support for sRGB texture format for gamma textures.
• DirectX and S3TC texture compression.
• Optimized for 32-, 24-, 16-, 15- and 8-bpp modes.
• True-color, 64x64 hardware cursor alpha.
• Multibuffering (double, triple or quad) for smooth animation and video playback.

Intellisample HCT Performance Technology
• Increased visual quality at higher resolutions through advances in compression, anisotropic filtering, and antialiasing technology.
• Blistering-fast antialiasing and compression performance.
• Support for advanced lossless compression algorithms for both color, texture, and z data at
even higher resolutions and frame rates.
• Fast z-clear.

UltraShadow Technology
• Accelerates shadow volumes for nextgeneration games.
• Accurately maintains shadows while discarding non-useful information.

Advanced Display Pipeline with Full nView Capabilities
• Integrated NTSC/PAL TV encoder supporting resolutions up to 1024x768 without the need for
panning with builtin Macrovision copy protection.
• DVD and HDTV-ready MPEG-2 decoding up to 1920x1080i resolutions.
• Dual, integrated 400MHz RAMDACs for display resolutions up to and including
2048x1536@85Hz
• Dual DVO ports for interfacing to external TMDS transmitters.
• Internal TV support.
• Dual internal TMDS encoders (one single and one Dual link) able to drive nextgeneration flat
panel displays with resolutions greater than 1600x1200.
• VIP 1.1 interface support for Video-In function.
• Microsoft Video Mixing Renderer (VMR) support f.or multiple video windows with full video
quality and features in each window.

Digital Vibrance control (DVC) 3.0
• DVC color controls.
• DVC image sharpening controls.

Advanced Technology
• AGP 8X including Fast Writes and sideband addressing.
• 0.13-micron process technology for higher levels of integration and higher operating clock
speeds.
• Advanced thermal management and thermal monitoring.
• 40 mmx40 mm, BGA 1309 flip-chip package.